Below is an excerpt of an article I co-authored in the latest issue of Nanochip Fab Solutions, an Applied Materials publication, on new green house gas regulationsand the pressure added to efforts to lower energy costs in the Fab.
Macro energy costs and the environmentalimpact of manufacturing are large and growing concerns for electronicscompanies and now, new legislation will impose even more stringentregulatory controls.
Beginning in 2011, new U.S. governmentregulations will mandate reporting of Green House Gas (GHG) consumptionand manufacturers in the State of California will be required to reportdemonstrated GHG reductions (see box). U.S. companies operating in Asia, Europe and Japan will also face regional carbon taxation and carbonaccounting requirements.
Compliance has already begun. InSeptember 2009, UMC became the first major device manufacturer toconduct carbon footprint inventory on its 200mm wafers according tointernational carbon footprint standard PAS2050, with the resultsreceiving third-party verification by Det Norske Veritas (DNV).
The challenge for device makers is toreduce energy consumption and therefore, carbon emissions, withoutcompromising on-wafer performance, throughput and environmental healthand safety compliance.